WIN Semiconductors’ new MW plastic QFN package solution won the 2019 EDI CON Innovation Product Award in material, PCB and package category on April 2, 2019. The package design features ultra-wideband and low-loss performance from DC to mm-Wave which covers the 5G mm-Wave application bands. The solution also provides a complete design model to reduce time to market for customer’s product. Moreover, due to the low cost manufacturing process and material, the plastic package type is much more cost effective than the ceramic solution. WIN Semiconductors’ MW package, indeed, let our customers keep leading in the future competition.
The EDI CON Product Innovation Awards honor products introduced in the previous year that have the greatest impact on the industry, providing the tools necessary to bring on the next generation of electronic design innovations. More information:http://www.ediconchina.com/news/pr_22.asp