About WIN

Milestone

WIN Semiconductors Corp.,founded in October 1999, is the first pure-play 6-inch GaAs foundry in the world, has established an advanced GaAs wafer fab in recognition of the growing demand for cost-effective manufacturing of high speed and high quality GaAs MMIC's (monolithic microwave ICs) and RFIC's (radio frequency ICs).

2020

  • Apr

    WIN ranked the top 10% among listed electronics companies with market value of NT$10 billion or more in Corporate Governance Evaluation

  • Apr

    WIN got the top 5% TPEx-listed companies in Corporate Governance Evaluation for six consecutive years

  • Feb

    WIN has been selected as Industry Mover for The Sustainability Yearbook 2020 published by S&P Global in collaboration with RobecoSAM

2019

  • Apr

    WIN got the top 5% TPEx-listed companies in Corporate Governance Evaluation for five consecutive years

2018

  • Apr

    WIN got the top 5% in Y2017 Corporate Governance Evaluation on TPEx-listed companies

  • Feb

    Pass SONY Green Partner certification (WIN Fab-B)

  • Jan

    Pass AS9100 certification

2017

  • Nov

    Morgan Stanley Capital International enlists WIN Semiconductors Corp. in MSCI Global Standard Indexes

  • Oct

    WIN market value broke NT$100 billion record

  • Apr

    WIN got the top 5% in Y2016 Corporate Governance Evaluation on TPEx-listed companies

2016

  • Sep

    WIN GaN technology project got A+ Industrial Innovative R&D Program of the MOEA

  • Aug

    To improve the capital structure and enhance return on equity, WIN conducted a 30% capital reduction by distributing cash to shareholders

  • Apr

    WIN got the top 5% in Y2015 Corporate Governance Evaluation on TPEx-listed companies

  • Apr

    Fab-C formally announced for mass production

  • Mar

    WIN attended the 2016 Optical Fiber Conference and launched foundry services for optical device manufacturing

  • Jan

    Fab-C completed the facility construction

2015

  • Dec

    Surpassed 1,000,000 wafers shipped

  • Jul

    To improve the capital structure and enhance return on equity, the Company conducted a 20% capital reduction by distributing cash to shareholders

  • Apr

    WIN Got the Top 5% in Y2014 Corporate Governance Evaluation on TPEx-listed Companies

2014

  • Feb

    Won 2nd Taiwan Mittelstand Award

2013

  • Dec

    Won 3rd National Industrial Innovation Award, Outstanding Enterprise Innovation Award category

2012

  • Dec

    Became one of the world's top 12 foundries, and the only one manufacturing GaAs products with 62.4% pure-play foundry service market share

  • Dec

    Awarded 2012 Best Technology Partner by Inphi, a publicly traded company in US

  • Dec

    Granted 2012 Best Supplier Award by muRata, a publicly traded company in Japan

  • Oct

    WIN participates in Seasoned Equity Offering and offers Global Depositary Receipts

2011

  • Dec

    Annual revenue broke NT$10 billion record

  • Dec

    Stock was offered publically in TPEx

  • Nov

    Awarded the best supplier award from M/A COM Technology Solutions

  • Oct

    Taipei Exchange (TPEx) awarded Contribution Excellence Golden Laurel Award to WIN Semiconductors Corp.

  • May

    Morgan Stanley Capital International enlists WIN Semiconductors Corp. in MSCI Index

2010

  • Dec

    Successfully developed the first 6-inch 0.1μm MMIC wafer in the world

  • Dec

    Developed high performance application for multiphase and multisystem cellphone switch process

  • Nov

    Passed ISO/TS 16949 certification

  • May

    Started the second phase expansion of Fab-B

  • Apr

    Acquired Fab-B second phase land and factory

2009

  • Oct

    Announced strategic partnership with Anadigics

  • Oct

    Initial public offering

  • Jul

    Successfully developed BiHEMT process to integrates both of HBT and pHEMT processes

  • Apr

    Fab-B mass production

2008

  • Oct

    The first pilot run of HBT GaAs wafer in Fab-B

  • Jun

    Skyworks Solution announced WIN as their official GaAs foundry

  • May

    Successfully developed 0.25μm pHEMT MMIC wafer process

2007

  • Dec

    Started making profit annually(EPS: NT$ 0.79)

  • Apr

    Established MMIC and Optoelectronic business units, lead by PhD Y.C. Wang and PhD W.M. Chang respectively

  • Apr

    Acquired Fab-B's land and factory

2005

  • May

    Successfully developed HBT process for high efficiency, high performance 2G/3G cellphone application

2004

  • Sep

    Pilot run of 0.5μm 35V pHEMT for CATV

  • Feb

    Baseline release of 2μm high ruggedness HBT

2003

  • Dec

    Shipped more than 1.5 million WLAN PAs in a single month

  • Feb

    The first 0.15um mHEMT wafer for customer

  • Jan

    Foundry production of customer specific 3μm HBT started

2002

  • Nov

    The first & largest pure-play GaAs wafer foundry service provider to pass ISO14001 & OHSAS18001 certification

  • Nov

    Pilot run release 0.15μm power pHEMT with 2-mil substrate

  • Nov

    Production released 1μm HBT

  • Oct

    Foundry production of 0.5μm power pHEMT

  • Jun

    The first 0.5μm switch pHEMT wafer for customer

  • Jun

    Demonstrated the first 6-inch pHEMT wafer with 1-mil substrate in the world

  • Jun

    Production release of 2μm HBT

  • May

    World's first 0.15μm mHEMT wafer on 6-inch GaAs

2001

  • Nov

    Began foundry production for 0.15μm pHEMT

  • Sep

    Pass QS-9000 & ISO9001 certification, creating a new quality certification record of III-V semiconductor industry

  • Jun

    Presented 6-inch GaAs 1μm HBT MMIC wafer

  • May

    Granted by Economy Ministry for R&D Project

  • May

    Produced the first 6-inch pHEMT MMIC wafer with 2-mil substrate in the world

  • Apr

    pHEMT preliminary design kit available

  • Mar

    Presented the first 6-inch 0.15μm GaAs pHEMT MMIC wafer in the world

  • Jan

    WIN Semiconductors Corp. initiated pre-initial public offering (pre-IPO)

2000

  • Nov

    Completed production of the first 6-inch GaAs HBT MMIC wafer in Asia

  • Sep

    Process equipment installation completed, process qualification initiated, and HBT preliminary design kit available

  • Jul

    Facility construction completed

1999

  • Dec

    Ground breaking ceremony for corporate offices & Fab-A

  • Oct

    WIN Semiconductors Corp. incorporated in Taiwan

About WIN

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