2019/09/30

WIN Semiconductors Celebrates 20 Years Of Compound Semiconductor Leadership

Sustained emphasis on technology innovation and manufacturing scale propelled WIN to become the largest pure-play III-V wafer foundry, and continued investment in 5G technologies position the company for future success…


Tao Yuan, Taiwan – September 30, 2019: WIN Semiconductors Corp (TPEx:3105), the world’s largest pure-play compound semiconductor foundry, commemorates the 20th anniversary of its founding in October 1999. Since the start of production from its first factory in Taoyuan City, Taiwan, WIN has grown faster than the compound semiconductor market and now operates three highly automated wafer fabs, employing nearly 3000 people. The company has achieved sustained business growth through continuous investment in leading edge III-V technologies, timely expansion of production capacity, and flexible efficient manufacturing. These core competencies provide a competitive advantage for WIN’s customers across a broad set of applications and end markets.


Key to WIN’s 20-year record of success is a portfolio of III-V technologies supporting diverse functions from RF and mmWave frequencies through light-wave applications. Critical components leveraging WIN’s HBT, pHEMT, GaN and VCSEL technologies touch billions of people every day and can be found in smartphones as well as the wireless and optical networks deployed across the Globe. This tradition of III-V innovation is now focused on advanced technologies to satisfy the stringent performance requirements of the 5G market. Multiple high-performance technologies are now commercially available, and deliver the optimal combination of performance, integration and efficiency for next generation 5G frontends, low latency connections and massive MIMO access points. This broad portfolio covers 5G sub-6GHz (<6GHz) bands for ubiquitous network coverage and mmWave (~30GHz) for the access points supporting fixed and mobile broadband services.


Reflecting on the company’s 20th anniversary, WIN CEO Kyle Chen said “WIN Semiconductors has achieved this milestone through the hard work of its dedicated employees, close relationships with our customers, and a deep understanding of III-V technology and the performance advantages provided by compound semiconductors. These key attributes enabled WIN to become the world’s largest pure-play III-V wafer foundry, and a key element of the global supply chain for RF, mmWave and optical components used in smartphones, fixed and wireless networks, and aerospace and defense systems.”


WIN Semiconductors Corp at European Microwave Week 2019, booth 1220

WIN Semiconductors Corp. will be celebrating its 20th anniversary and showcasing its compound semiconductor RF and mm-Wave solutions in booth 1220 at the 2019 European Microwave Week being held in Paris, France September 29th through October 4th, 2019


For more information, visit WIN Semiconductors Corp. at https://www.winfoundry.com/


About WIN Semiconductors Corp

WIN Semiconductors Corp. is the leading global provider of pure-play GaAs and GaN wafer foundry services for the wireless, infrastructure and networking markets. WIN provides its foundry partners a diverse portfolio of Hetero-junction Bipolar Transistor and Pseudomorphic High Electron Mobility Transistor, PIN Diode and Optical Device technology solutions that support leading edge products for applications from 50 MHz to 150 GHz and through light-wave. Custom products built by WIN Semiconductors Corp. are found in a vast array of markets, including smartphone, mobile infrastructure, 3-D sensing, optical communications, CATV, aerospace, defense and automotive applications.


For 20 years, WIN has provided foundry services from its state of the art, ISO9001/14001 certified 150mm GaAs facility headquartered in Taoyuan City, Taiwan. This multi-site manufacturing facility has approximately 3000 employees and provides WIN customers with a diverse array of device technology platforms and value added services, including DC/RF product testing, Cu wafer bumping and advanced package solutions for accelerated product development.